GENEVA, Sept. 24 -- RESONAC CORPORATION filed a patent application (JP2025/010854) for “THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION DEVICE, METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET, AND RESIN COMPOSITION”. With publication no. WO/2026/196514, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/373
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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