International Patent: THERMALLY CONDUCTIVE PAD AND PREPARATION METHOD THEREFOR, ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

GENEVA, July 27 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/146183) for “THERMALLY CONDUCTIVE PAD AND PREPARATION METHOD THEREFOR, ELECTRONIC COMPONENT AND ELECTRONIC DEVICE”. With publication no. WO/2026/153094, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 7/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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