GENEVA, July 9 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/078713) for “THERMALLY CONDUCTIVE PAD AND ELECTRONIC DEVICE”. With publication no. WO/2026/045165, here are the other details related to the patent application:
Kind: Corrected version of pamphlet [A9]
IPC: H05K 7/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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