International Patent: THERMAL DISSIPATION ASSEMBLY FOR ELECTRONIC APPARATUS

GENEVA, Sept. 7 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (EP2025/055302) for “THERMAL DISSIPATION ASSEMBLY FOR ELECTRONIC APPARATUS”. With publication no. WO/2026/180059, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: F28D 15/0208

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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