GENEVA, March 17 -- THE YOKOHAMA RUBBER CO., LTD. (2-1, Oiwake, Hiratsuka-shi, Kanagawa2548601), 横浜ゴム株式会社 (神奈川県平塚市追分２番１号) filed a patent application (PCT/JP2025/029486) for "SENSOR MODULE MANAGEMENT DEVICE" on Aug 22, 2025. With publication no. WO/2026/053754, the details related to the patent application was published on Mar 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MATSUDA Jun (c/o The Yokohama Rubber Co., Ltd., Hiratsuka Factory, 2-1,...