INTERNATIONAL PATENT: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY FILES APPLICATION FOR "ELECTRO-STIMULATIVE, HYDROPHILIC-HYDROPHOBIC DUAL-STRUCTURED METALLIC MESH WOUND DRESSING"

GENEVA, April 29 -- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Clear Water Bay, KowloonHong Kong) filed a patent application (PCT/IB2025/000561) for "ELECTRO-STIMULATIVE, HYDROPHILIC-HYDROPHOBIC DUAL-STRUCTURED METALLIC MESH WOUND DRESSING" on Oct 17, 2025. With publication no. WO/2026/083126, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAM, David Chuen Chun (c/o The Hong Kong University of Science and TechnoClear Water Bay, KowloonHong Kong), ZHANG, Zhe (c/o The Hong Kong University of Science and Technonlog...