INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE WITH A CIRCUIT COMPONENT EMBEDDED IN A PACKAGING SUBSTRATE"

GENEVA, April 8 -- TEXAS INSTRUMENTS INCORPORATED (P. O. Box 655474, Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2025/048194) for "SEMICONDUCTOR PACKAGE WITH A CIRCUIT COMPONENT EMBEDDED IN A PACKAGING SUBSTRATE" on Sep 26, 2025. With publication no. WO/2026/072964, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BAKSHI, Harshpreet, Singh Phull (12500 TI BoulevardDallas, TX 75243), YU, Tao (12500 TI BoulevardDallas, TX 75243), MURUGAN, Rajen (12500 TI BoulevardDallas, TX 75243), CHEN, Jie (12...