GENEVA, July 2 -- TDK ELECTRONICS AG filed a patent application (EP2025/081362) for “TEMPERATURE SENSOR WITH ENCAPSULATION AND MANUFACTURING METHOD”. With publication no. WO/2026/130830, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01C 1/028
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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