International Patent: TEMPERATURE SENSOR MODULE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE

GENEVA, Aug. 7 -- DENSO CORPORATION filed a patent application (JP2026/002666) for “TEMPERATURE SENSOR MODULE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE”. With publication no. WO/2026/164091, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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