INTERNATIONAL PATENT: TEIJIN LIMITED, 帝人株式会社 FILES APPLICATION FOR "RESIN COMPOSITION AND MOLDED ARTICLE"

GENEVA, May 5 -- TEIJIN LIMITED (2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka5300005), 帝人株式会社 (大阪府大阪市北区中之島三丁目２番４号) filed a patent application (PCT/JP2025/036576) for "RESIN COMPOSITION AND MOLDED ARTICLE" on Oct 17, 2025. With publication no. WO/2026/088872, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ONIZAWA, Tomomitsu (c/o Teijin Limited, 2-4, ...