INTERNATIONAL PATENT: TECHNISCHE UNIVERSITEIT DELFT FILES APPLICATION FOR "REVERSIBLE AND DEBONDABLE STRUCTURAL SOLDER FOR CONNECTING A GLASS SUBSTRATE TO A SECOND SUBSTRATE"

GENEVA, March 23 -- TECHNISCHE UNIVERSITEIT DELFT (Stevinweg 12628 CN Delft) filed a patent application (PCT/EP2025/075702) for "REVERSIBLE AND DEBONDABLE STRUCTURAL SOLDER FOR CONNECTING A GLASS SUBSTRATE TO A SECOND SUBSTRATE" on Sep 09, 2025. With publication no. WO/2026/057599, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HARTWELL, Rebecca Carol (Stevinweg 12628 CN Delft), OVEREND, Mauro (Stevinweg 12628 CN Delft)

Abstract: Method of manufacturing a debondable structural solder joint (1) comprising a glass substra...