GENEVA, April 7 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku, Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2025/033016) for "POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE COMPOSITION, POLYIMIDE FILM, COPPER FOIL WITH RESIN, MULTILAYER WIRING BOARD, COIL STRUCTURE, MAGNETIC DEVICE, AND INSULATED WIRE" on Sep 19, 2025. With publication no. WO/2026/070640, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under th...