INTERNATIONAL PATENT: TAIYO HOLDINGS CO., LTD., 太陽ホールディングス株式会社, DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "FIRST LAMINATE STRUCTURE, SECOND LAMINATE STRUCTURE AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD"

Posted On: 2026-01-06

GENEVA, Jan. 6 -- TAIYO HOLDINGS CO., LTD. (388, Oaza Okura, Ranzan-machi, Hiki-gun, Saitama3550222), 太陽ホールディングス株式会社 (埼玉県比企郡嵐山町大字大蔵３８８番地), DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区坂下三丁目３５番５８号) filed a patent application (PCT/JP2025/021048) for "FIRST LAMINATE STRUCTURE, SECOND LAMINATE STRUCTURE, AND METHOD FOR ...

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INTERNATIONAL PATENT: TAIYO HOLDINGS CO., LTD., 太陽ホールディングス株式会社, DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "FIRST LAMINATE STRUCTURE, SECOND LAMINATE STRUCTURE AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD"