GENEVA, July 31 -- SCHLUMBERGER TECHNOLOGY CORPORATION filed a patent application (US2026/012204) for “SYSTEMS AND METHODS FOR SINTERING THICK DIAMOND ON SUBSTRATE”. With publication no. WO/2026/161601, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: E21B 10/55
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....