GENEVA, Oct. 1 -- SLC CORPORATION filed a patent application (US2025/024215) for “SYSTEM AND METHOD FOR SECURE-CORE SILICON MOBILE END-POINTS TO DETERMINE KYC AND KYT”. With publication no. WO/2026/192596, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04L 9/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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