GENEVA, Sept. 18 -- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY filed a patent application (CN2025/126364) for “SYSTEM AND METHOD FOR IMPROVING ACCURACY OF TRANSIENT PLANE SOURCE THERMAL CONDUCTIVITY MEASUREMENT”. With publication no. WO/2026/184082, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01N 25/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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