INTERNATIONAL PATENT: SUZHOU VEGA TECHNOLOGY CO., LTD., 苏州维嘉科技股份有限公司 FILES APPLICATION FOR "METHOD FOR DETERMINING BACK-DRILLING DEPTH, METHOD FOR MEASURING THICKNESS OF CIRCUIT BOARD AND METHOD FOR GENERATING OBJECT PARAMETER"
GENEVA, May 9 -- SUZHOU VEGA TECHNOLOGY CO., LTD. (No.188, Chuangyuan Road, Dushu Lake S & T Innovation Gulf, Industrial ParkSuzhou, Jiangsu 215000), 苏州维嘉科技股份有限公司 (中国江苏省苏州市工业园区独墅湖科教创新区创苑路188号) filed a patent application (PCT/CN2025/101559) for "METHOD FOR DETERMINING BACK-DRILLING DEPTH, METHOD FOR MEASURING THICKNESS OF CIRCUIT BOARD, AND METHOD FOR GENERATING OBJECT PARAMETER" on Jun 17, 2025. With publication no. WO/2026/091556, the details related to the patent application was published on...
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