GENEVA, Oct. 15 -- LSI SOLUTIONS, INC. filed a patent application (US2026/025419) for “SUTURE MANAGEMENT DEVICE”. With publication no. WO/2026/218032, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: A61B 17/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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