GENEVA, Sept. 18 -- QUALCOMM INCORPORATED filed a patent application (CN2025/080960) for “SUPPLEMENTAL UPLINK COMMUNICATIONS”. With publication no. WO/2026/183770, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04W 72/0453
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....