International Patent: SUPER JUNCTION DEVICE AND FORMING METHOD THEREFOR

GENEVA, Aug. 31 -- SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION filed a patent application (CN2025/079758) for “SUPER JUNCTION DEVICE AND FORMING METHOD THEREFOR”. With publication no. WO/2026/174616, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10D 62/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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