GENEVA, March 30 -- SUMCO CORPORATION (1-2-1, Shibaura, Minato-ku, Tokyo1058634), 株式会社ＳＵＭＣＯ (東京都港区芝浦一丁目２番１号) filed a patent application (PCT/JP2025/016788) for "METHOD FOR PRODUCING WAFER" on May 08, 2025. With publication no. WO/2026/062957, the details related to the patent application was published on Mar 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HASHIMOTO, Daisuke (c/o SUMCO CORPORATION 1-2-1, Shibaura, Minato-ku, Tokyo...