INTERNATIONAL PATENT: SUMCO CORPORATION, 株式会社ＳＵＭＣＯ FILES APPLICATION FOR "METHOD FOR DETECTING THICKNESS VARIATION IN CIRCUMFERENTIAL DIRECTION OF WORKPIECE"

GENEVA, March 24 -- SUMCO CORPORATION (2-1, Shibaura 1-chome, Minato-ku, Tokyo1058634), 株式会社ＳＵＭＣＯ (東京都港区芝浦一丁目２番１号) filed a patent application (PCT/JP2025/029759) for "METHOD FOR DETECTING THICKNESS VARIATION IN CIRCUMFERENTIAL DIRECTION OF WORKPIECE" on Aug 25, 2025. With publication no. WO/2026/058683, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TANAKA Arashi...