International Patent: SUBSTRATE PROCESSING SYSTEM, RING REPLACEMENT METHOD, AND PROGRAM

GENEVA, Aug. 14 -- TOKYO ELECTRON LIMITED filed a patent application (JP2026/002230) for “SUBSTRATE PROCESSING SYSTEM, RING REPLACEMENT METHOD, AND PROGRAM”. With publication no. WO/2026/168187, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 72/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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