GENEVA, July 2 -- RESONAC CORPORATION filed a patent application (JP2024/045050) for “SUBSTRATE MATERIAL, METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING PREPREG, METHOD FOR PRODUCING SUBSTRATE MATERIAL, AND METHOD FOR INSPECTING SUBSTRATE MATERIAL”. With publication no. WO/2026/133513, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/14
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....