International Patent: SUBSTRATE CLAMPING DEVICE AND SUBSTRATE PROCESSING DEVICE COMPRISING SAME

GENEVA, Oct. 30 -- ACM RESEARCH (SHANGHAI) , INC. filed a patent application (CN2026/081037) for “SUBSTRATE CLAMPING DEVICE AND SUBSTRATE PROCESSING DEVICE COMPRISING SAME”. With publication no. WO/2026/223232, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 72/70

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....