GENEVA, Aug. 14 -- LG INNOTEK CO., LTD. filed a patent application (KR2026/001639) for “SUBSTRATE ASSEMBLY, METHOD FOR MANUFACTURING SUBSTRATE ASSEMBLY, AND POWER DEVICE”. With publication no. WO/2026/168859, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/11
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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