GENEVA, May 11 -- STEMCO CO., LTD. (79-44, Gwahaksaneop 4-ro, Oksan-myeon, HeungdeokguCheongju-SiChungcheongbuk-do 28122), 스템코 주식회사 (충청북도청주시흥덕구 옥산면 과학산업4로 79-44) filed a patent application (PCT/KR2025/013930) for "MULTILAYER CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE INCLUDING MULTILAYER CIRCUIT BOARD" on Sep 09, 2025. With publication no. WO/2026/095320, the details related to the patent application was published on May 07, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is ...