GENEVA, July 2 -- INTERNATIONAL BUSINESS MACHINES CORPORATION filed a patent application (IB2025/062052) for “STACKED LOGIC AND CHIP-SCALE INTERPOSERS”. With publication no. WO/2026/132949, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 72/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....