GENEVA, July 6 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2025/022129) for “SSB STRUCTURE FOR ENHANCED NETWORK ENERGY SAVING IN WIRELESS COMMUNICATION SYSTEM”. With publication no. WO/2026/142161, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04W 52/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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