GENEVA, Aug. 31 -- SEKISUI TECHNO MOLDING CO., LTD. filed a patent application (JP2026/004800) for “SPLIT BODY, SUPPORT MEMBER OF SUPPORT COLUMN, AND METHOD FOR INSTALLING SUPPORT COLUMN”. With publication no. WO/2026/177016, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: E02D 27/42
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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