INTERNATIONAL PATENT: SOUTH CHINA UNIVERSITY OF TECHNOLOGY, 华南理工大学 FILES APPLICATION FOR "THERMAL-ELECTRIC COUPLED SINTERING APPARATUS FOR BINDER JETTING 3D-PRINTED METAL POWDER GREEN BODIES AND SINTERING METHOD THEREFOR"

GENEVA, April 27 -- SOUTH CHINA UNIVERSITY OF TECHNOLOGY (No.381, Wushan Road, Tianhe DistrictGuangzhou, Guangdong 510640), 华南理工大学 (中国广东省广州市天河区五山路381号) filed a patent application (PCT/CN2025/128238) for "THERMAL-ELECTRIC COUPLED SINTERING APPARATUS FOR BINDER JETTING 3D-PRINTED METAL POWDER GREEN BODIES, AND SINTERING METHOD THEREFOR" on Oct 16, 2025. With publication no. WO/2026/082140, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Worl...