GENEVA, Aug. 21 -- FUJIFILM CORPORATION filed a patent application (JP2026/001010) for “SOUND PROOFING/INSULATING MATERIAL AND MANUFACTURING METHOD FOR SOUND PROOFING/INSULATING MATERIAL”. With publication no. WO/2026/172718, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G10K 11/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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