GENEVA, April 28 -- SONY GROUP CORPORATION (1-7-1 Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都港区港南一丁目７番１号) filed a patent application (PCT/JP2025/012878) for "RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAID RESIN COMPOSITION" on Mar 28, 2025. With publication no. WO/2026/083616, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): UEDA ...