INTERNATIONAL PATENT: SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD., 广州汉源微电子封装材料有限公司 FILES APPLICATION FOR "LOW-RESIDUE FLUX AND PREPARATION METHOD THEREFOR AND USE THEREOF"

GENEVA, March 29 -- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD. (No. 58, Nanyun 2nd RoadScience City, Huangpu DistrictGuangzhou, Guangdong 510663), 广州汉源微电子封装材料有限公司 (中国广东省广州市黄埔区科学城南云二路58号) filed a patent application (PCT/CN2025/095873) for "LOW-RESIDUE FLUX, AND PREPARATION METHOD THEREFOR AND USE THEREOF" on May 20, 2025. With publication no. WO/2026/060979, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the Inte...