International Patent: SOLDER AREA FORMED TO CAPTURE TWO WIRES

GENEVA, Aug. 7 -- KOLLMORGEN CORPORATION filed a patent application (US2026/013496) for “SOLDER AREA FORMED TO CAPTURE TWO WIRES”. With publication no. WO/2026/165478, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/11

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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