GENEVA, March 10 -- SMC CORPORATION (5-5, Kyobashi 1-chome, Chuo-ku, Tokyo1040031), ＳＭＣ株式会社 (東京都中央区京橋一丁目５番５号) filed a patent application (PCT/JP2025/013530) for "MODULE SYSTEM AND EXTERNAL OUTPUT MODULE" on Apr 02, 2025. With publication no. WO/2026/048116, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KOBAYASHI Yuri (c/o SMC CORPORATION, TSUKUBA TECHNICAL CENTER, 2-2,...