INTERNATIONAL PATENT: SMART PACKAGING SOLUTIONS FILES APPLICATION FOR "METHOD FOR MANUFACTURING AN ELECTRONIC CIRCUIT FOR A CHIPPED DOCUMENT"

GENEVA, April 5 -- SMART PACKAGING SOLUTIONS (85 AV DE LA PLAINE IN Groupe13790 Rousset) filed a patent application (PCT/EP2025/076835) for "METHOD FOR MANUFACTURING AN ELECTRONIC CIRCUIT FOR A CHIPPED DOCUMENT" on Sep 19, 2025. With publication no. WO/2026/068363, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CUENOT, Yves-Pierre (85 AV DE LA PLAINEC/O SPS - IN Groupe13790 Rousset), CARRIER, Cecile (85 AV DE LA PLAINEC/O SPS - IN Groupe13790 Rousset), AKRICH, Mohamed (85 avenue de la plaineC/O SPS - IN Groupe13790 Rouss...