INTERNATIONAL PATENT: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM), FU, MEIWEN FILES APPLICATION FOR "PERFORATED THERMAL INTERFACE MATERIAL LAYER"

GENEVA, April 17 -- SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM) (10951 White Rock Rd, Rancho CordovaCalifornia 95670), FU, Meiwen (10951 White Rock Rd, Rancho CordovaCalifornia 95670) filed a patent application (PCT/CN2024/124373) for "PERFORATED THERMAL INTERFACE MATERIAL LAYER" on Oct 12, 2024. With publication no. WO/2026/076699, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SINGH, Hardeep (10951 White Rock Rd, Rancho CordovaCalifornia 95670), NANGARE, Sanket (10951 White Rock Rd, Rancho CordovaCalifornia 95...