GENEVA, Oct. 1 -- MITSUI KINZOKU COMPANY, LIMITED filed a patent application (JP2026/007817) for “SINTERED BODY AND MATERIAL FOR SINTERING”. With publication no. WO/2026/191655, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C04B 35/44
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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