GENEVA, Oct. 30 -- HITACHI, LTD. filed a patent application (JP2026/002259) for “SINTER-BONDING MATERIAL AND SEMICONDUCTOR POWER MODULE”. With publication no. WO/2026/225038, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 72/30
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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