International Patent: SINGLE-WAFER ULTRASONIC SUBSTRATE CLEANING MACHINE AND VIBRATOR UNIT FOR SAME

GENEVA, July 31 -- HONDA ELECTRONICS CO., LTD. filed a patent application (JP2025/001668) for “SINGLE-WAFER ULTRASONIC SUBSTRATE CLEANING MACHINE AND VIBRATOR UNIT FOR SAME”. With publication no. WO/2026/159766, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/304

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....