GENEVA, July 1 -- MULTIVERSE COMPUTING, S.L. filed a patent application (EP2025/086214) for “SIMULATION SYSTEM AND METHOD FOR MATERIAL DEFORMATION”. With publication no. WO/2026/125426, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06F 30/23
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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