GENEVA, Oct. 9 -- MITSUI KINZOKU COMPANY, LIMITED filed a patent application (JP2026/012138) for “SILVER-COATED COPPER POWDER, CONDUCTIVE RESIN COMPOSITION CONTAINING SAID SILVER-COATED COPPER POWDER, METHOD FOR PRODUCING SAID SILVER-COATED COPPER POWDER, AND METHOD FOR EVALUATING UNIFORMITY OF SILVER COATING LAYER IN SAID SILVER-COATED COPPER POWDER”. With publication no. WO/2026/211513, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B22F 1/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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