GENEVA, July 31 -- MITSUBISHI CHEMICAL CORPORATION filed a patent application (JP2026/001684) for “SILICA PARTICLES, SILICA SOL, METHOD FOR PRODUCING SILICA PARTICLES, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE”. With publication no. WO/2026/160342, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C01B 33/141
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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