INTERNATIONAL PATENT: SIKA TECHNOLOGY AG FILES APPLICATION FOR "METHOD OF BONDING PARTS FOR IMPROVED ADHESION"

GENEVA, May 4 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/080709) for "METHOD OF BONDING PARTS FOR IMPROVED ADHESION" on Oct 23, 2025. With publication no. WO/2026/087709, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIN, Geng (c/o Sika Corporation30800 Stephenson-HighwayMadison Heights, Michigan 48071), ORZECH, Leonard Edward (c/o Sika Corporation30800 Stephenson-HighwayMadison Heights, Michigan 48071), MEIER, Michael (c/o Sika Automotive AGKreuzlingerstrasse 358590 Romansho...