GENEVA, March 30 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/077103) for "EXPANDABLE THERMOSETTING EPOXY RESIN COMPOSITION WITH IMPROVED DUCTILITY" on Sep 23, 2025. With publication no. WO/2026/062282, the details related to the patent application was published on Mar 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MADAUS, Brandon (c/o Sika Corporation30800 Stephenson HighwayMadison Heights, Michigan 48071)
Abstract: The present invention relates to a one-component thermosetting epoxy resin composition, comprising a) at least one epoxy resin A...