GENEVA, May 18 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/081681) for "A HOT-MELT ADHESIVE HAVING IMPROVED HEAT STABILITY" on Nov 03, 2025. With publication no. WO/2026/099121, the details related to the patent application was published on May 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TEPELMANN, Weng (c/o Sika Automotive Deutschland GmbHReichsbahnstrasse 9922525 Hamburg)
Abstract: The invention relates to an adhesive composition comprising: a) At least one polymer P, b) A stabilizer S comprising b1) At least one first stabilizer S1 and ...