GENEVA, Sept. 7 -- RESONAC CORPORATION filed a patent application (JP2026/007534) for “SIC WAFER, SIC EPITAXIAL WAFER, AND SIC DEVICE”. With publication no. WO/2026/182243, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C30B 29/36
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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