GENEVA, Feb. 17 -- SHISEIDO COMPANY, LTD. (5-5, Ginza 7-chome, Chuo-ku, Tokyo1040061), 株式会社資生堂 (東京都中央区銀座７丁目５番５号) filed a patent application (PCT/JP2025/026171) for "COMPOSITION, FILM-FORMING AGENT, KIT, METHOD FOR FORMING SECOND COMPOSITION ON FIRST OBJECT, AND METHOD FOR PRODUCING FILM-LIKE COMPOSITION" on Jul 23, 2025. With publication no. WO/2026/034209, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property ...