GENEVA, Nov. 23 -- SHENZHEN PHOTOSENS SEMICONDUCTOR CO.LTD (Room 405, Comprehensive Building, Building A, ICC Industrial City, Hou Rui Community, Hangcheng Subdistrict, Bao'an DistrictShenzhen, Guangdong 518000), 深圳光感半导体有限公司 (中国广东省深圳市宝安区航城街道后瑞社区ICC产业城A栋综合楼405) filed a patent application (PCT/CN2025/084088) for "SPECTRAL CHIP PREPARATION METHOD AND SPECTRAL CHIP" on Mar 21, 2025. With publication no. WO/2025/236853, the details related to the patent application was published on Nov 20, 2...